​Vacuum Reflow Die Bonding

  • MeChip HSM-812VN Semiconductor V
    MeChip HSM-812VN Semiconductor Vacuum Oven, This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor v
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  • MeChip HSM-1012VNL Semiconductor
    HSM-1012VNL Semiconductor Vacuum Oven, This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor vacuum soldering equipment, specialized for SOP, SOT, DIP, QFN, QFP, BGA, IGBT, TO, MINI LED and other vac...
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  • MeChip HSM-1012VN Semiconductor
    MeChip HSM-1012VN Semiconductor Vacuum Oven, This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor
    read more
  • Mechip HSM-1013VNL Semiconductor
    This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor vacuum soldering equipment, specialized forSOP, SOT, DIP, QFN, QFP, BGA, IGBT, TO, MINI LED and other vacuum chip package soldering;
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    A total of 1 pages 4

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