Vacuum Reflow Die Bonding
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MeChip HSM-812VN Semiconductor VMeChip HSM-812VN Semiconductor Vacuum Oven, This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor vread more
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MeChip HSM-1012VNL SemiconductorHSM-1012VNL Semiconductor Vacuum Oven, This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor vacuum soldering equipment, specialized for SOP, SOT, DIP, QFN, QFP, BGA, IGBT, TO, MINI LED and other vac...read more
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MeChip HSM-1012VN SemiconductorMeChip HSM-1012VN Semiconductor Vacuum Oven, This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductorread more
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Mechip HSM-1013VNL SemiconductorThis equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor vacuum soldering equipment, specialized forSOP, SOT, DIP, QFN, QFP, BGA, IGBT, TO, MINI LED and other vacuum chip package soldering;read more
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